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Formation of adherent polypyrrole coatings on Ti and Ti–6Al–4V alloy

机译:Ti和Ti–6Al–4V合金上形成粘附的聚吡咯涂层

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摘要

Highly adherent polypyrrole coatings were electrodeposited at etched Ti and Ti–6Al–4V from 0.2 M oxalic acid and 0.2 M pyrrole at a constant applied potential of 0.8 V versus SCE. The substrates were etched in an alkaline peroxide solution at ambient temperature for a 10 min period prior to the electropolymerization reactions. Chemical etching of the substrate gave rise to an increase in the hydrophilicity of the surface, the formation of a micro-etched surface and the formation of a semiconducting titanium oxide film. There was a considerable increase in the density of nucleation sites for polypyrrole growth at the micro-etched surface. Growth of the polypyrrole proceeded slowly from a high number of nucleation sites at the etched surface to give rise to a highly adherent polypyrrole coating. Adhesion of the polypyrrole coating was attributed to micro-etching of the substrate and the conductivity of the oxide film generated during the chemical etching process.
机译:相对于SCE,在0.2 V的草酸和0.2 M的吡咯中,高附着力的聚吡咯涂层被电沉积在Ti和Ti-6Al-4V蚀刻后的电势上。在电聚合反应之前,将基板在环境温度的碱性过氧化物溶液中蚀刻10分钟。基板的化学蚀刻导致表面亲水性的增加,微蚀刻表面的形成以及半导体氧化钛膜的形成。在微蚀刻表面上,聚吡咯生长的成核位点密度显着增加。聚吡咯的生长从蚀刻表面上的大量成核位置开始缓慢进行,从而产生高度附着的聚吡咯涂层。聚吡咯涂层的粘附力归因于基板的微蚀刻以及在化学蚀刻过程中产生的氧化膜的电导率。

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